

FURUYA DENKI
Wafer Processing Tapes
Explore our comprehensive selection of high-performance wafer processing tapes, including backgrinding and dicing tapes. Designed for semiconductor manufacturing, they offer precise adhesion, easy residue-free peeling, and reliable protection during thinning and dicing processes.
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FURUYA DENKI is an independent supplier and is not affiliated with or authorized by the brands shown on this page. Brand names, trademarks and part numbers are used for identification only. Availability, specifications, condition, origin, documentation, lead time and warranty are subject to our formal quotation. Please verify all technical requirements before ordering. Images are for reference only.