Aremco Ceramabond 571 High-Temperature Magnesium Oxide Ceramic Potting Compound

Aremco Ceramabond 571 is a fast-setting, two-component inorganic ceramic potting compound formulated with magnesium oxide (MgO) for extreme-temperature encapsulation up to 1760°C (3200°F). It is specifically designed for potting and encapsulating sensitive temperature sensors, thermocouples, igniters, and induction heating coils where high dielectric strength and high thermal conductivity are paramount.

Key Features & Benefits:

- Ultra-High Temperature Capability: Performs reliably up to 1760°C (3200°F) in oxidizing and reducing atmospheres.

- Fast Room-Temperature Cure: Sets rapidly at ambient temperature with post-baking options for full mechanical and dielectric development.

- Superior Thermal Conductivity & Insulation: High thermal transfer rate paired with exceptional dielectric breakdown resistance prevents electrical shorting at elevated temperatures.

- Low Shrinkage & Moisture Resistance: Maintains dimensional stability with minimal shrinkage during curing and thermal cycling.

Typical Applications:

- Potting and encapsulating high-temperature thermocouples, RTDs, and temperature probes.

- Encapsulating heating elements, ignition devices, and induction heating coils.

- High-temperature electrical insulation for feedthroughs, headers, and power electronics.