NIKKA SEIKO ASTROLIQUID is an advanced temporary liquid mounting wax specially formulated for the backside grinding and thinning process of patterned semiconductor device wafers. It provides excellent gap-filling capability over surface topographies, protecting circuit patterns from mechanical damage and stress during back-grinding.
Key Features & Benefits:
- Superior Pattern Protection: Fills and planarizes micro-structures on patterned wafers, providing robust support against localized pressure and cracking.
- Adjustable Coating Thickness: Film thickness can be precisely controlled by choosing different concentration or viscosity grades to match varying bump or pattern heights.
- Excellent Adhesion & Workability: Maintains uniform holding strength across spin-coating, drying, and mechanical grinding steps.
- Easy Solvent Dewaxing: Cleans off rapidly and completely using standard organic solvents like Isopropanol (IPA) without leaving organic residue or damaging circuits.
Typical Applications:
- Temporary mounting and protection of patterned silicon and compound semiconductor wafers during backside grinding (BG) and polishing.
- Fixturing device wafers with surface topographies for precision thinning in advanced packaging workflows.
- Protective temporary encapsulation during wafer handling and dicing processes.