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nikka-seiko-astroliquid-temporary-liquid-mounting-wax

NIKKA SEIKO ASTROLIQUID Temporary Liquid Mounting Wax for Patterned Wafer

NIKKA SEIKO

Model / Part Number: ASTROLIQUID Series

Availability subject to quotation and stock confirmation

Supplied for maintenance, retrofit and replacement projects. Exact suffix, configuration and condition must be confirmed before ordering.

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BrandNIKKA SEIKO
Model / Part NumberASTROLIQUID Series
Country of OriginConfirm by lot

FURUYA DENKI is an independent supplier and is not affiliated with or authorized by the brands shown on this page. Brand names, trademarks and part numbers are used for identification only. Availability, specifications, condition, origin, documentation, lead time and warranty are subject to our formal quotation. Please verify all technical requirements before ordering. Images are for reference only.

▣ Product Overview

NIKKA SEIKO ASTROLIQUID is an advanced temporary liquid mounting wax specially formulated for the backside grinding and thinning process of patterned semiconductor device wafers. It provides excellent gap-filling capability over surface topographies, protecting circuit patterns from mechanical damage and stress during back-grinding.

Key Features & Benefits:
- Superior Pattern Protection: Fills and planarizes micro-structures on patterned wafers, providing robust support against localized pressure and cracking.
- Adjustable Coating Thickness: Film thickness can be precisely controlled by choosing different concentration or viscosity grades to match varying bump or pattern heights.
- Excellent Adhesion & Workability: Maintains uniform holding strength across spin-coating, drying, and mechanical grinding steps.
- Easy Solvent Dewaxing: Cleans off rapidly and completely using standard organic solvents like Isopropanol (IPA) without leaving organic residue or damaging circuits.

Typical Applications:
- Temporary mounting and protection of patterned silicon and compound semiconductor wafers during backside grinding (BG) and polishing.
- Fixturing device wafers with surface topographies for precision thinning in advanced packaging workflows.
- Protective temporary encapsulation during wafer handling and dicing processes.

⚙ Technical Specifications

BrandNIKKA SEIKO
Product SeriesASTROLIQUID
Product FormLiquid / Spin-Coatable
Application MethodSpin Coating / Automatic Wafer Mounter
Soluble SolventIsopropanol (IPA), Acetone, Organic Solvents
Primary ApplicationPatterned Wafer Backside Grinding & Thinning

▦ Typical Applications

  • Patterned Semiconductor Wafer Thinning
  • Backside Grinding (BG)
  • Advanced Packaging
  • Micro-Electronics Manufacturing

▰ Availability & Delivery

Availability & DeliveryAvailability subject to quotation and stock confirmation
Lead TimeIn stock, typically ships within 3-5 business days. Standard export packaging available.
Shipping OptionsAir freight, sea freight, express
PackagingSecure export packaging