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NIKKA SEIKO SKYLIQUID Temporary Liquid Mounting Wax for Wafer Thinning

NIKKA SEIKO SKYLIQUID Temporary Liquid Mounting Adhesive

NIKKA SEIKO

Model / Part Number: SKYLIQUID Series

Availability subject to quotation and stock confirmation

Supplied for maintenance, retrofit and replacement projects. Exact suffix, configuration and condition must be confirmed before ordering.

pcsRequest a Quote
WhatsApp InquiryResponse within 1 business day
BrandNIKKA SEIKO
Model / Part NumberSKYLIQUID Series
Country of OriginConfirm by lot

FURUYA DENKI is an independent supplier and is not affiliated with or authorized by the brands shown on this page. Brand names, trademarks and part numbers are used for identification only. Availability, specifications, condition, origin, documentation, lead time and warranty are subject to our formal quotation. Please verify all technical requirements before ordering. Images are for reference only.

▣ Product Overview

NIKKA SEIKO SKYLIQUID is an advanced liquid-state temporary mounting adhesive developed for precision substrate processing where heat-sensitive materials require room-temperature bonding. It is designed for thin-wafer back-grinding, polishing, and delicate optical glass machining without introducing thermal deformation or mechanical strain.

Key Features & Benefits:
- Room-Temperature Application: Liquid form enables easy spin-coating and roll-coating at room temperature, protecting heat-sensitive workpieces.
- Uniform Thin Film: Achieves ultra-thin, highly uniform layer thickness for superior TTV (Total Thickness Variation) control during grinding.
- Excellent Shock Absorption: Cushions mechanical impacts during dicing and lapping, preventing substrate cracking or micro-chipping.
- Clean Solvent Removability: Dissolves cleanly in alcohol solvents like Isopropanol (IPA), acetone, or specialized hydrocarbon cleaners.

Typical Applications:
- Temporary bonding of compound semiconductors (GaAs, InP, GaN) for backside grinding and polishing.
- Fixturing thin optical filters, quartz substrates, and glass wafers for high-precision slicing.
- Surface protective coating for delicate components during mechanical handling and dicing.

⚙ Technical Specifications

BrandNIKKA SEIKO
Product SeriesSKYLIQUID
Product FormLiquid / Spin-Coatable
Application MethodSpin Coating / Roll Coating / Dispense
Soluble SolventIsopropanol (IPA), Acetone, Organic Solvents
Primary ApplicationThin Wafer Back-Grinding & Optical Glass Mounting

▦ Typical Applications

  • Semiconductor Wafer Thinning
  • Compound Semiconductor Processing
  • Optical Glass Manufacturing
  • Micro-Electronics

▰ Availability & Delivery

Availability & DeliveryAvailability subject to quotation and stock confirmation
Lead TimeIn stock, typically ships within 3-5 business days. Standard export packaging available.
Shipping OptionsAir freight, sea freight, express
PackagingSecure export packaging