NIKKA SEIKO SKYWAX is an advanced temporary bonding wax developed for high-precision thinning, grinding, and polishing operations of delicate substrates. It provides excellent planar uniformity and stress relief, making it an essential consumable in semiconductor wafer processing and optical component manufacturing.
Key Features & Benefits:
- High Parallelism & Flatness: Maintains uniform thickness across thin wafers and glass substrates during high-pressure polishing.
- Superior Shock Absorption: Absorbs mechanical vibration during slicing and grinding to prevent edge chipping and surface micro-cracks.
- Easy Thermal & Solvent Stripping: Softens cleanly at designated melting points and dissolves efficiently in standard organic solvents like IPA or acetone.
- High Chemical Stability: Resistant to water-soluble cutting fluids and slurry chemicals during CMP and mechanical polishing.
Typical Applications:
- Temporary mounting of silicon, quartz, and sapphire substrates for double-side polishing.
- Holding ceramic wafers and magnetic heads during surface micro-grinding.
- Fixturing optical lenses and filters during slicing and shape processing.