NIKKA SEIKO SPACELIQUID High-Thermal & Chemical Resistant Liquid Mounting Wax

NIKKA SEIKO SPACELIQUID is a premium temporary liquid mounting wax specifically developed for demanding semiconductor device manufacturing, including advanced patterned wafer thinning, backside grinding (BG), and subsequent chemical/thermal processes. Featuring an elevated softening point, high chemical durability, and low outgassing characteristics, SPACELIQUID ensures zero damage to sensitive circuit topographies under extreme working conditions.

Key Features & Benefits:

- Thick Protective Encapsulation: Forms a film layer 5 to 10 times thicker than conventional liquid waxes, fully protecting high bumps, tall micro-patterns, and device structures.

- High Thermal & Chemical Resistance: Withstands high process temperatures and aggressive chemical environments without softening or degrading during grinding and etching.

- Low Outgassing Properties: Formulated for high-vacuum and cleanroom environments, preventing contamination of critical semiconductor processing tools.

- Easy Dewaxing: Completely and cleanly removed using specialized organic solvents or hydrocarbon cleaning agents without leaving organic residues.

Typical Applications:

- Temporary bonding and backside grinding of patterned semiconductor device wafers with tall bumps or steep topographies.

- Surface protective encapsulation during chemical etching, polishing, and high-temperature vacuum steps.

- Fixturing fragile MEMS wafers and advanced compound semiconductor devices during micro-machining.