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NIKKA SEIKO W, Q, U, B BOND Two-Component Epoxy Adhesive for Ingot Slicing

NIKKA SEIKO W, Q, U, B BOND Temporary Removable Epoxy Adhesives

NIKKA SEIKO

Model / Part Number: W, Q, U, B BOND Series

Availability subject to quotation and stock confirmation

Supplied for maintenance, retrofit and replacement projects. Exact suffix, configuration and condition must be confirmed before ordering.

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WhatsApp InquiryResponse within 1 business day
BrandNIKKA SEIKO
Model / Part NumberW, Q, U, B BOND Series
Country of OriginConfirm by lot

FURUYA DENKI is an independent supplier and is not affiliated with or authorized by the brands shown on this page. Brand names, trademarks and part numbers are used for identification only. Availability, specifications, condition, origin, documentation, lead time and warranty are subject to our formal quotation. Please verify all technical requirements before ordering. Images are for reference only.

▣ Product Overview

NIKKA SEIKO W, Q, U, B BOND series are specialized two-component removable epoxy adhesives developed for heavy-duty temporary bonding during ingot slicing and block cutting operations. Engineered to withstand high cutting loads, thermal shock, and slurry exposure during diamond wire saw processing, these adhesives deliver maximum holding force while remaining easily removable post-process.

Key Features & Benefits:
- Ultra-High Mechanical Strength: Rigid bond line prevents ingot movement, kerf loss, or wafer chipping during high-speed wire saw slicing.
- Fast Curing & Versatile Options: Available in various formulations including quick-cure types and high-adhesion grades tailored to specific cycle times.
- Easy Hot Water Removal: Specially formulated bond matrix degrades efficiently in hot water or mild designated epoxy removers without damaging sliced wafers.
- Convenient Mixing Ratios: Designed with user-friendly 1:1 or 2:1 mixing ratios for manual or automated dispenser applications.

Typical Applications:
- Temporary bonding of silicon, quartz, and compound semiconductor ingots to glass or resin carriers for wire saw slicing.
- Securing advanced ceramic blocks and magnetic cores during precision multi-blade cutting.
- Heavy-load temporary fixturing of large optical crystals prior to slicing and lapping.

⚙ Technical Specifications

BrandNIKKA SEIKO
Product SeriesW, Q, U, B BOND
Chemical TypeTwo-Component Removable Epoxy Adhesive
Mixing Ratio (Resin:Hardener)1:1 or 2:1
Removal MethodHot Water / Designated Epoxy Remover
Primary ApplicationIngot Slicing & Heavy-Load Wire Sawing

▦ Typical Applications

  • Semiconductor Ingot Slicing
  • Solar Silicon Wafering
  • Advanced Ceramic Block Cutting
  • Optical Material Machining

▰ Availability & Delivery

Availability & DeliveryAvailability subject to quotation and stock confirmation
Lead TimeIn stock, typically ships within 3-5 business days. Standard export packaging available.
Shipping OptionsAir freight, sea freight, express
PackagingSecure export packaging