Founded in Japan in 1937, DISCO Corporation is a global market leader in Kiru (Cutting), Kezuru (Grinding), and Migaku (Polishing) technologies. The company manufactures state-of-the-art precision equipment and processing tools essential for semiconductor wafer fabrication, microelectronics, and advanced material processing.
Key Product Lines & Solutions:
- Dicing Saws: Advanced dual-spindle and laser dicing systems engineered for ultra-thin wafer sectioning and micro-chip singulation.
- Surface Grinders & Polishers: High-precision grinders and chemical mechanical polishers for silicon, SiC, GaAs, and sapphire substrates.
- Precision Diamond Tools: Industry-standard dicing blades, grinding wheels, and dry polishing wheels tailored for extreme micro-machining accuracy.
- Laser Processing Systems: Stealth dicing and laser grooving solutions for delicate semiconductor materials.
DISCO provides trusted, sub-micron precision manufacturing technologies that power semiconductor foundries and high-tech material processing facilities globally.
Brand summary
DISCO Corporation is a Japanese multinational manufacturer and global leader in semiconductor processing equipment. Specializing in 'Kiru, Kezuru, Migaku' (Cut, Grind, Polish) technologies, primary products include precision dicing saws, laser grooving systems, surface grinders, CMP polishers, and diamond dicing blades designed for silicon wafers, SiC substrates, and advanced microelectronics manufacturing.
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