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Aremco-Bond 556 Electrically Conductive Silver Filled Epoxy Adhesive

Aremco-Bond 556 High-Conductivity Electrically & Thermally Conductive Silver Epoxy

Aremco

Model / Part Number: Aremco-Bond 556

Availability subject to quotation and stock confirmation

Supplied for maintenance, retrofit and replacement projects. Exact suffix, configuration and condition must be confirmed before ordering.

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WhatsApp InquiryResponse within 1 business day
BrandAremco
Model / Part NumberAremco-Bond 556
Country of OriginConfirm by lot

FURUYA DENKI is an independent supplier and is not affiliated with or authorized by the brands shown on this page. Brand names, trademarks and part numbers are used for identification only. Availability, specifications, condition, origin, documentation, lead time and warranty are subject to our formal quotation. Please verify all technical requirements before ordering. Images are for reference only.

▣ Product Overview

Aremco-Bond 556 is a premium two-component, silver-filled epoxy formulation engineered for critical microelectronic, semiconductor, and optoelectronic bonding applications requiring ultra-low volume resistivity and excellent thermal dissipation up to 190°C (374°F). It serves as a high-reliability alternative to lead-based solders, bonding temperature-sensitive electronic substrates without thermal degradation.

Key Features & Benefits:
- Ultra-Low Electrical Resistivity: Achieves volume resistivity as low as 0.0009 Ohm-cm, ensuring seamless electrical conduction for signal and power paths.
- High Thermal Conductivity: Rapidly dissipates heat away from sensitive semiconductor dies and power chips to heat sinks.
- Superior Shear Strength: Forms a high-latch, vibration-resistant structural bond to gold, silver, copper, brass, ceramic, and glass substrates.
- Easy 1:1 Mix Ratio: Convenient 1:1 volume mix ratio allows straightforward dispensing via manual syringes or automatic micro-dispensing systems.

Typical Applications:
- Semiconductor die attach and chip bonding in hybrid microelectronics and power modules.
- Attaching lead wires, RF shielding cans, and grounding straps to printed circuit boards (PCBs).
- Bonding LED chips, thermistors, and heat-sensitive sensors where fluxless solder replacement is required.

⚙ Technical Specifications

BrandAremco
Product SeriesAremco-Bond
Filler MaterialSilver (Ag)
Volume Resistivity0.0009 Ohm-cm
Max Operating Temperature190 °C
Primary ApplicationElectrically & Thermally Conductive Die Attach & Circuit Bonding

▦ Typical Applications

  • Microelectronic Packaging
  • Semiconductor Die Attach
  • Microwave Component Bonding
  • Hybrid Circuits
  • EMI/RFI Shielding

▰ Availability & Delivery

Availability & DeliveryAvailability subject to quotation and stock confirmation
Lead TimeIn stock, typically ships within 3-5 business days. Standard export packaging available.
Shipping OptionsAir freight, sea freight, express
PackagingSecure export packaging