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Conductive, Thermal Interface and EMI Shielding Materials for Electronics Packaging

FURUYA DENKI

Conductive, Thermal & EMI Shielding Materials

Explore our comprehensive selection of electrically conductive adhesives, thermal interface materials, and EMI shielding solutions. Engineered for microelectronics, semiconductor packaging, and power electronics to ensure optimal heat dissipation, signal integrity, and electromagnetic protection.

Aremco-Bond 568 Thermally Conductive Aluminum Filled Epoxy Adhesive

Aremco

Aremco-Bond 568

Availability subject to quotation and stock confirmation
Category
Conductive, Thermal & EMI Shielding Materials
Lead time
In stock, typically ships within 3-5 business days. Standard export packaging available.
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Aremco Pyro-Duct 597-A Ultra High Temperature Silver Conductive Coating

Aremco

Pyro-Duct 597-A

Availability subject to quotation and stock confirmation
Category
Conductive, Thermal & EMI Shielding Materials
Lead time
In stock, typically ships within 3-5 business days. Standard export packaging available.
View details
Aremco-Bond 556 Electrically Conductive Silver Filled Epoxy Adhesive

Aremco

Aremco-Bond 556

Availability subject to quotation and stock confirmation
Category
Conductive, Thermal & EMI Shielding Materials
Lead time
In stock, typically ships within 3-5 business days. Standard export packaging available.
View details

FURUYA DENKI is an independent supplier and is not affiliated with or authorized by the brands shown on this page. Brand names, trademarks and part numbers are used for identification only. Availability, specifications, condition, origin, documentation, lead time and warranty are subject to our formal quotation. Please verify all technical requirements before ordering. Images are for reference only.