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Aremco-Bond 568 Thermally Conductive Aluminum Filled Epoxy Adhesive

Aremco-Bond 568 High Thermal Conductivity Aluminum-Filled Epoxy Adhesive

Aremco

Model / Part Number: Aremco-Bond 568

Availability subject to quotation and stock confirmation

Supplied for maintenance, retrofit and replacement projects. Exact suffix, configuration and condition must be confirmed before ordering.

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BrandAremco
Model / Part NumberAremco-Bond 568
Country of OriginConfirm by lot

FURUYA DENKI is an independent supplier and is not affiliated with or authorized by the brands shown on this page. Brand names, trademarks and part numbers are used for identification only. Availability, specifications, condition, origin, documentation, lead time and warranty are subject to our formal quotation. Please verify all technical requirements before ordering. Images are for reference only.

▣ Product Overview

Aremco-Bond 568 is a high-performance, two-component aluminum-filled epoxy adhesive engineered for demanding thermal management and heat dissipation applications up to 204°C (400°F). It combines high thermal conductivity with excellent dielectric strength, providing an ideal bonding solution for heat sinks, power transistors, LED assemblies, and industrial electronic components.

Key Features & Benefits:
- Superior Thermal Dissipation: High aluminum loading provides exceptional thermal conductivity to transfer heat rapidly away from sensitive components.
- Electrical Insulation: Maintains high volume resistivity and dielectric strength to prevent short circuits between heat sinks and active circuitry.
- Convenient 1:1 Mix Ratio: Easy 1:1 mix ratio by volume or weight simplifies manual mixing and automatic dispensing.
- Strong Adhesion & Chemical Resistance: Forms a rugged structural bond to aluminum, copper, brass, stainless steel, ceramics, and glass with high resistance to moisture, fuels, and industrial solvents.

Typical Applications:
- Bonding heat sinks, cooling plates, and heat spreaders to power modules and microprocessors.
- Thermally conductive potting and encapsulation of power supplies, transformers, and coils.
- Structural assembly of LED light engines, power transistors, and automotive electronic control units (ECUs).

⚙ Technical Specifications

BrandAremco
Product SeriesAremco-Bond
Filler MaterialAluminum (Al)
Max Operating Temperature204 °C
ComponentsTwo-Component (1:1 Volume Ratio)
Primary ApplicationThermally Conductive & Electrically Insulating Heat Sink Bonding

▦ Typical Applications

  • Power Electronics
  • Heat Sink Attachment
  • Power Supply Modules
  • Automotive Electronics
  • LED Thermal Management

▰ Availability & Delivery

Availability & DeliveryAvailability subject to quotation and stock confirmation
Lead TimeIn stock, typically ships within 3-5 business days. Standard export packaging available.
Shipping OptionsAir freight, sea freight, express
PackagingSecure export packaging